● The equipment is capable of performing pin reshaping and repair for chips in QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SO, SOP, SOIC, SOL, DL(SSOP) and other package types.

● The IC is manually placed in the chip positioning fixture, and an elastic mechanism automatically presses the chip to prevent movement that could result in shaping failure, while also avoiding damage to the chip.

● The IC pins are automatically reshaped and repaired in both horizontal (spacing) and vertical (coplanarity) directions without manual adjustment.

● The computer stores various reshaping programmes corresponding to chip types, and the reshaping process parameters can be pre-programmed according to the chip samples provided by the user.

● Devices with the same pin pitch can use the same reshaping comb without replacement, and ICs with the same chip body size can use the same set of positioning fixtures without replacement.

● Quick-change chip positioning fixtures and reshaping combs enable rapid product switching, suitable for multi-variety mass production.

● The reshaping comb with a specially inclined tooth design is inserted from the pin base to the device, improving alignment efficiency and reliability, and reducing requirements for pre-reshaping chip pins.

● Complete system protection functions are provided, including multiple warning signals, emergency stop, and automatic alarm functions.

● The modular structure design allows easy expansion, upgrade and maintenance.

● Reshaping and repair are monitored under an electron microscope, reducing eye fatigue.

● Anti-static functionality ensures electrostatic safety of the shaped devices.

● Changeover time: 5-6 minutes

● Types of shaping combs: 0.4mm, 0.5mm, 0.635mm, 0.65mm, 0.8mm, 1.0mm, 1.27mm, 2.54mm (choose the comb according to different pin pitches)

● Chip positioning fixture size: positioning tolerance range s0.05mm (fixture selected according to different chips)

● Applicable chip types: IC packages such as QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, SO, SOL, DL, PGA, etc.

● Chip body size range: 5mmx5mm to 50mmx50mm

● Pin spacing range: 0.4mm-2.54mm

● Plastic repair pin deviation range: ≤±26.7% of the pin width

● Plastic surgery restoration accuracy: ±0.03mm

● Chip pin coplanarity after repair: ≤0.1mm

● Power supply: AC200V-240V, 50/60Hz

● Power supply: AC200V-240V, 50/60Hz ...

● Device dimensions: 760mm(L) x 700mm(W) x 760mm(H)

● Operating temperature: 0°C to 50°C, suitable for laboratory and field environments

● Humidity: below 60%